Topical Symposium 2
This session focuses on all aspects of material science related to thin films and coatings deposited on polymer substrates as well as metal-polymer and ceramic-polymer composite materials in general. Both fundamental and applied contributions on the following topics are highly welcome: Thin films for flexible electronics applications (conductive, semiconducting, magnetic, barrier layers, encapsulation, etc.), Additive manufacturing and other novel methods for thin film fabrication, Atomic Layer (ALD) and Molecular Layer Deposition (MLD), Fabrication and properties of metal-polymer/ceramic-polymer composites and interfaces, 3D printing of metal-polymer composites, Functional and mechanical properties of novel alloys deposited on polymer substrates (high-entropy alloys, metallic glasses, etc.), and Flexible and stretchable electronic devices.
TS2. Invited Speakers:
- Patric Gruber, KIT Karlsruhe, Germany, “Electromechanical Behavior of Evaporated and Printed Thin Films and Devices on Compliant Substrates”
- Peter Zalar, Holst Centre / TNO, Netherlands, “Development and Application of Screen-Printed Large-Area Sensing Surfaces”